Memory system and operating method thereof

ABSTRACT

There are provided a memory system and an operating method thereof. The memory system includes a semiconductor memory configured to perform a memory operation and perform a suspend operation of suspending a currently performed memory operation and a controller configured to control the memory operation. The controller controls the semiconductor memory to perform the suspend operation in a suspension-allowed period by determining a detailed operation period of the currently performed memory operation.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.16/825,796 filed on Mar. 20, 2020, which claims benefits of priority ofKorean Patent Application No. 10-2019-0149048 filed on Nov. 19, 2019.The disclosure of each of the foregoing application is incorporatedherein by reference in its entirety.

BACKGROUND Field of Invention

The present disclosure generally relates to an electronic device, andmore particularly, to a memory system and an operating method thereof.

Description of Related Art

The paradigm on recent computer environment has turned into a ubiquitouscomputing environment in which computing systems can be used virtuallyanywhere and anytime. This promotes increasing usage of portableelectronic devices such as mobile phones, digital cameras, notebookcomputers, and the like. Such portable electronic devices may generallyinclude a memory system using a memory device, i.e., a data storagedevice. The data storage device is used as a main memory device or anauxiliary memory device of the portable electronic devices.

A data storage device using a memory device has excellent stability anddurability, high information access speed, and low power consumption,since there is no mechanical driving part. In an example of memorysystems having such advantages, the data storage device may include aUniversal Serial Bus (USB) memory device, memory cards having variousinterfaces, a Solid State Drive (SSD), and the like.

The memory device is generally classified into a volatile memory deviceand a nonvolatile memory device.

The nonvolatile memory device has relatively slow write and read speeds,but retains stored data even when the supply of power is interrupted.Thus, the nonvolatile memory device is used to store data to be retainedregardless of whether power is supplied.

Examples of the volatile memory include a Read Only Memory (ROM), a MaskROM (MROM), a Programmable ROM (PROM), an Electrically Programmable ROM(EPROM), an Electrically Erasable and Programmable ROM (EEPROM), a flashmemory, a Phase-change RAM (PRAM), a Magnetic RAM (MRAM), a ResistiveRAM (RRAM), a Ferroelectric RAM (FRAM), and the like. The flash memoryis classified into a NOR type flash memory and a NAND type flash memory.

SUMMARY

Embodiments provide a memory system capable of avoiding a suspendoperation in a period in which the reliability of a semiconductor memoryis degraded, and an operating method of the memory system.

In accordance with an aspect of the present disclosure, there isprovided a memory system including: a semiconductor memory configured toperform a memory operation and perform a suspend operation of suspendinga currently performed memory operation; and a controller configured tocontrol the memory operation, wherein the controller controls thesemiconductor memory to perform the suspend operation in asuspension-allowed period by determining a detailed operation period ofthe currently performed memory operation.

In accordance with another aspect of the present disclosure, there isprovided a memory system including: a memory device including aplurality of semiconductor memories; and a controller configured tocontrol a selected semiconductor memory of the plurality ofsemiconductor memories to perform a suspend operation of suspending acurrently performed memory operation of the selected semiconductormemory and a read operation when a host command corresponding to theread operation is received from a host, wherein the controllerdetermines a detailed period of the currently performed memoryoperation, and controls the selected semiconductor memory to perform thesuspend operation when the detailed period corresponds to asuspension-allowed period.

In accordance with still another aspect of the present disclosure, thereis provided a method for operating a memory system, the methodincluding: generating a status read command to determine a current stateof a semiconductor memory in response to a request from a host; readingstatus data of the semiconductor memory in response to the status readcommand and outputting the status data to a controller; determining adetailed period of a currently performed memory operation of thesemiconductor memory based on a ready/busy signal and the status data ofthe semiconductor memory; outputting a suspend command such that thesemiconductor memory suspends the currently performed memory operationwhen the detailed period is a suspension-allowed period; and suspendingthe currently performed memory operation in response to the suspendcommand.

In accordance with still another aspect of the present disclosure, thereis provided an operating method for a controller for controlling amemory device, the method including: perform a second memory operationwhile suspending a first memory operation which is currently beingperformed, during a suspension-allowed period of the first memoryoperation; and resume the suspended first memory operation uponcompletion of the second memory operation.

In accordance with still another aspect of the present disclosure, thereis provided an operating method of a memory device, the methodincluding: performing a second memory operation while suspending a firstmemory operation, which is currently being performed, during asuspension-allowed period of the first memory operation; and resumingthe suspended first memory operation upon completion of the secondmemory operation.

BRIEF DESCRIPTION OF THE DRAWINGS

Example embodiments will now be described more fully hereinafter withreference to the accompanying drawings; however, the example embodimentsmay be embodied in different forms and should not be construed aslimited to the embodiments set forth herein. Rather, these embodimentsare provided so that this disclosure will be thorough and complete, andwill fully convey the scope of the example embodiments to those skilledin the art.

In the drawing figures, dimensions may be exaggerated for clarity ofillustration. It will be understood that when an element is referred toas being “between” two elements, it can be the only element between thetwo elements, or one or more intervening elements may also be present.Like reference numerals refer to like elements throughout.

FIG. 1 is a block diagram illustrating a memory system in accordancewith an embodiment of the present disclosure.

FIG. 2 is a block diagram illustrating a configuration of a controllershown in FIG. 1.

FIG. 3 is a block diagram illustrating a suspend controller shown inFIG. 2.

FIG. 4 is a diagram illustrating a semiconductor memory shown in FIG. 1.

FIG. 5 is a diagram illustrating a memory block shown in FIG. 4.

FIG. 6 is a diagram illustrating an embodiment of a three-dimensionallyconfigured memory block.

FIG. 7 is a diagram illustrating another embodiment of thethree-dimensionally configured memory block.

FIG. 8 is a flowchart illustrating an operating method of the memorysystem in accordance with an embodiment of the present disclosure.

FIG. 9 is a flowchart illustrating an operating method of the memorysystem in accordance with another embodiment of the present disclosure.

FIGS. 10A to 10C are diagrams illustrating status read commands in asuspend operation in accordance with an embodiment of the presentdisclosure.

FIGS. 11A and 11B are diagrams illustrating configurations of an eraseoperation and a program operation.

FIG. 12 is a diagram illustrating another embodiment of the memorysystem.

FIG. 13 is a diagram illustrating another embodiment of the memorysystem.

FIG. 14 is a diagram illustrating another embodiment of the memorysystem.

FIG. 15 is a diagram illustrating another embodiment of the memorysystem.

DETAILED DESCRIPTION

The specific structural or functional description disclosed herein ismerely illustrative for the purpose of describing embodiments accordingto the concept of the present disclosure. The embodiments according tothe concept of the present disclosure can be implemented in variousforms, and should not be construed as limited to the embodiments setforth herein.

Hereinafter, exemplary embodiments of the present disclosure will bedescribed in detail with reference to the accompanying drawings in orderfor those skilled in the art to be able to readily implement thetechnical spirit of the present disclosure.

FIG. 1 is a block diagram illustrating a memory system in accordancewith an embodiment of the present disclosure.

Referring to FIG. 1, the memory system 1000 includes a memory device1100 and a controller 1200. The memory device 1100 includes a pluralityof semiconductor memories 100. The plurality of semiconductor memories100 may be divided into a plurality of groups GR1 to GRn.

In FIG. 1, illustrates that the plurality of groups GR1 to GRncommunicate with the controller 1200 respectively through first to nthchannels CH1 to CHn. Each semiconductor memory 100 will be describedlater with reference to FIG. 4.

Each of the plurality of groups GR1 to GRn communicates with thecontroller 1200 through one common channel. The controller 1200 controlsthe plurality of semiconductor memories 100 of the memory device 1100through the plurality of channels CH1 to CHn.

The controller 1200 is coupled between a host 1400 and the memory device1100. The controller 1200 accesses the memory device 1100 in response toa request from the host 1400. For example, the controller 1200 controlsread, write, erase, and background operations of the memory device 1100in response to a request received from the host 1400. The controller1200 provides an interface between the memory device 1100 and the host1400. The controller 1200 drives firmware for controlling the memorydevice 1100. Also, when a read command is received from the host 1400,the controller 1200 may perform a suspend control operation ofcontrolling a selected semiconductor memory 100 included in the memorydevice 1100 to suspend a currently ongoing memory operation of theselected memory 100 and to perform a read operation. In the suspendcontrol operation, the controller 1200 may control a semiconductormemory 100 selected to perform a status read operation to determine acurrent state of the selected semiconductor memory 100, determine thecurrently ongoing memory operation, based on status data read as aresult of the status read operation, and control the selectedsemiconductor memory 100 to perform a suspend operation of the operationbeing currently performed during an operation period corresponding to asuspension-allowed period. For example, a suspension-allowed periodduring a program operation may be the other operation period except aperiod in which a program pulse is applied, and a suspension-allowedperiod during an erase operation may be the other operation periodexcept a period in which a Gate Induced Drain Leakage (GIDL) current isgenerated.

The host 1400 controls the memory system 1000. The host 1400 includesportable electronic devices such as a computer, a PDA, a PMP, an MP3player, a camera, a camcorder, and a mobile phone. The host 1400 mayrequest a write operation, a read operation, an erase operation, etc. ofthe memory system 1000 through a command.

The controller 1200 and the memory device 1100 may be integrated intoone semiconductor device. In an exemplary embodiment, the controller1200 and the memory device 1100 may be integrated into one semiconductordevice, to constitute a memory card. For example, the controller 1200and the memory device 1100 may be integrated into one semiconductordevice, to constitute a memory card such as a PC card (Personal ComputerMemory Card International Association (PCMCIA)), a Compact Flash (CF)card, a Smart Media Card (SM or SMC), a memory stick, a Multi-Media Card(MMC, RS-MMC or MMCmicro), an SD card (SD, miniSD, microSD or SDHC), ora Universal Flash Storage (UFS).

The controller 1200 and the memory device 1100 may be integrated intoone semiconductor device to constitute a semiconductor drive (SolidState Drive (SSD)). The semiconductor drive SSD includes a storagedevice configured to store data in a semiconductor memory. When thememory system 1000 is used as the semiconductor drive (SDD), theoperating speed of the host 1400 coupled to the memory system 1000 isremarkably improved.

In another example, the memory system 1000 may be provided as one ofvarious components of an electronic device such as a computer, an UltraMobile PC (UMPC), a workstation, a net-book, a Personal DigitalAssistant (PDA), a portable computer, a web tablet, a wireless phone, amobile phone, a smart phone, an e-book, a Portable Multi-Media Player(PMP), a portable game console, a navigation system, a black box, adigital camera, a 3-dimensional television, a digital audio recorder, adigital audio player, a digital picture recorder, a digital pictureplayer, a digital video recorder, a digital video player, a devicecapable of transmitting/receiving information in a wireless environment,one of various electronic devices that constitute a home network, one ofvarious electronic devices that constitute a computer network, one ofvarious electronic devices that constitute a telematics network, an RFIDdevice, or one of various components that constitute a computing system.

In an exemplary embodiment, the memory device 1100 or the memory system1000 may be packaged in various forms. For example, the memory device1100 or the memory system 1000 may be packaged in a manner such asPackage On Package (PoP), Ball Grid Arrays (BGAs), Chip Scale Packages(CSPs), Plastic Leaded Chip Carrier (PLCC), Plastic Dual In-line Package(PDIP), die in Waffle pack, die in wafer form, Chip On Board (COB),CERamic Dual In-line Package (CERDIP), Plastic Metric Quad Flat Pack(PMQFP), Thin Quad Flat Pack (TQFP), Small Outline Integrated Circuit(SOIC), Shrink Small Outline Package (SSOP), Thin Small Outline Package(TSOP), System In Package (SIP), Multi-Chip Package (MCP), Wafer-levelFabricated Package (WFP), or Wafer-level processed Stack Package (WSP).

FIG. 2 is a block diagram illustrating a configuration of the controllershown in FIG. 1.

Referring to FIG. 2, the controller 1200 may include a host controller1210, a processor 1220, a memory buffer 1230, an error corrector 1240, aflash controller 1250, and a bus 1310.

The bus 1310 may provide a channel between components of the controller1200.

The host controller 1210 may control data transmission between the host1400 shown in FIG. 1 and the memory buffer 1230. In an example, the hostcontroller 1210 may control an operation of buffering data input fromthe host 1400 to the memory buffer 1230. In another example, the hostcontroller 1210 may control an operation of outputting, to the host1400, the data buffered to the memory buffer 1230. The host controller1210 may include a host interface.

The processor 1220 may control the overall operations of the controller1200, and perform a logical operation. The processor 1220 maycommunicate with the host 1400 shown in FIG. 1 through the hostcontroller 1210, and communicate with the memory device 1100 shown inFIG. 1 through the flash controller 1250. For example, when a pluralityof host commands (a write command, a read command, an erase command, andthe like) are received from the host 1400, the processor 1220 maygenerate a command queue by queuing the plurality of host commandsaccording to an order of priority.

Also, the processor 1220 may control the memory buffer 1230. Theprocessor 1220 may control an operation of the memory system 1000 byusing the memory buffer 1230 as a working memory, a cache memory, or abuffer memory.

The processor 1220 may include a Flash Translation Layer (hereinafter,referred to as ‘FTL’) 1221 and a suspend controller 1222.

The FTL 1221 drives firmware stored in the memory buffer 1230. Also, theFTL 1221 may map a corresponding physical address to a logical addressinput from the host 1400 shown in FIG. 1 in a data write operation.Also, the FTL 1221 checks the physical address mapped to the logicaladdress input from the host 1400 in a data read operation.

When a read request is received from the host 1400, the suspendcontroller 1222 may control the memory device (1100 shown in FIG. 1) toperform the read operation more preferentially than other requests whichare already queued and still pending. For example, the suspendcontroller 1222 may control, by determining a current status of aselected semiconductor memory included in the memory device (1100 shownin FIG. 1), the selected semiconductor memory to immediately perform aread operation or to perform a suspend operation of suspending acurrently ongoing memory operation and then perform the read operation.The suspend controller 1222 may control the selected semiconductormemory to perform the suspend operation in a suspension-allowed periodother than a suspension-prohibited period by determining a detailedoperation period of the currently ongoing memory operation.

The memory buffer 1230 may be used as a working memory, cache memory orbuffer memory of the processor 1220. The memory buffer 1230 may storecodes and commands, which are executed by the processor 1220. The memorybuffer 1230 may store data processed by the processor 1220. The memorybuffer 1230 may include a Static RAM (SRAM) or a Dynamic RAM (DRAM). Thememory buffer 1230 may store a command queue generated by the processor1220.

The error corrector 1240 may perform error correction. The errorcorrector 1240 may perform Error Correction Code (ECC) encoding, basedon data to be written to the memory device 1100 shown in FIG. 1 throughthe flash controller 1250. The ECC-encoded data may be transferred tothe memory device 1100 through the flash controller 1250. The errorcorrector 1240 may perform ECC decoding on data received from the memorydevice 1100 through the flash controller 1250. In an example, the errorcorrector 1240 may be included in the flash controller 1250 as acomponent of the flash controller 1250.

The flash controller 1250 generates and outputs an internal command forcontrolling the memory device 1100 in response to a command queuegenerated by the processor 1220. The flash controller 1250 may control aprogram operation by transmitting data buffered to the memory buffer1230 to the memory device 1100 in a data write operation. In anotherexample, the flash controller 1250 may control an operation of bufferingdata read and output from the memory device 1100 to the memory buffer1230 in response to the command queue in a read operation. The flashcontroller 1250 may include a flash interface.

FIG. 3 is a block diagram illustrating the suspend controller shown inFIG. 2.

Referring to FIG. 3, the suspend controller 1222 may include a statuschecker 1222A, a suspend determiner 1222B, and a command generator1222C.

The status checker 1222A generates and outputs a status read commandSR_CMD for controlling a selected semiconductor memory among theplurality of semiconductor memories 100 included in the memory device(1100 shown in FIG. 1) to perform a status read operation of theselected semiconductor memory, in response to a host command Host_CMDcorresponding to a read operation from the host (1400 shown in FIG. 1)and a suspend disable signal suspend_dis generated by the suspenddeterminer 1222B. The status read command SR_CMD output from the statuschecker 1222A may be transmitted to the selected semiconductor memorythrough the flash controller shown in FIG. 2.

The suspend determiner 1222B determines a current state of a selectedsemiconductor memory among the plurality of semiconductor memories 100included in the memory device (1100 shown in FIG. 1), based on aready/busy signal R/B and status read data SR_DATA, which are receivedfrom the selected semiconductor memory, and determines whether theselected semiconductor memory is allowed to perform a suspend operationbased on the determination result.

For example, the suspend determiner 1222B may determine, based on theready/busy signal R/B, whether the selected semiconductor memory is in aready state in which the selected memory device is ready for anoperation without currently performing program, read or erase operationsor in a busy state in which the selected semiconductor memory isperforming any one of the program, read and erase operations. Forexample, when the selected semiconductor memory is in the ready state,the suspend determiner 1222B determines that the selected semiconductormemory is allowed to perform the suspend operation, and generates andoutputs a suspend enable signal suspend_en.

When the selected semiconductor memory is in the busy state, the suspenddeterminer 1222B determines, based on the status read data SR_DATA,whether the selected semiconductor memory is allowed to perform thesuspend operation. For example, when it is determined that the selectedsemiconductor memory currently performs a read operation, based on thestatus read data SR_DATA, the suspend determiner 1222B determines thatthe selected semiconductor memory is not allowed to perform the suspendoperation, and generates and outputs the suspend disable signalsuspend_dis. For example, when it is determined, based on the statusread data SR_DATA, that the selected semiconductor memory currentlyperforms a program operation and performs an operation corresponding tothe suspension-allowed period during the program operation, the suspenddeterminer 1222B determines that the selected semiconductor memory isallowed to perform the suspend operation, and generates and outputs thesuspend enable signal suspend_en. For example, when it is determined,based on the status read data SR_DATA, that the selected semiconductormemory currently performs a program operation and performs an operationcorresponding to the suspension-prohibited period during the programoperation, the suspend determiner 1222B determines that the selectedsemiconductor memory is not allowed to perform the suspend operation,and generates and outputs the suspend disable signal suspend_dis. Forexample, when it is determined, based on the status read data SR_DATA,that the selected semiconductor memory currently performs an eraseoperation and performs an operation corresponding to thesuspension-allowed period during the erase operation, the suspenddeterminer 1222B determines that the selected semiconductor memory 100is allowed to perform the suspend operation, and generates and outputsthe suspend enable signal suspend_en. For example, when it isdetermined, based on the status read data SR_DATA, that the selectedsemiconductor memory currently performs an erase operation and performsan operation corresponding to the suspension-prohibited period duringthe erase operation, the suspend determiner 1222B determines that theselected semiconductor memory 100 is not allowed to perform the suspendoperation, and generates and outputs the suspend disable signalsuspend_d is.

For example, the suspension-prohibited period during the programoperation may be a period in which a program pulse is applied, and thesuspension-allowed period during the program operation may be a periodother than the suspension-prohibited period during the programoperation. For example, the suspension-prohibited period during theerase operation may be a period in which a GIDL current is generated,and the suspension-allowed period during the erase operation may be aperiod other than the suspension-prohibited period during the eraseoperation.

The command generator 1222C generates and outputs a suspend commandSuspend_CMD for suspending the currently ongoing memory operation of aselected semiconductor memory, in response to the suspend enable signalsuspend_en generated by the suspend determiner 1222B. Also, the commandgenerator 1222C generates and outputs a read command Read_CMD forcontrolling the selected semiconductor memory in a ready state or asuspend state to perform a read operation, in response to the hostcommand Host_CMD. Also, the command generator 1222C generates andoutputs a resume command Resume_CMD for controlling the semiconductormemory in the suspend state to resume the suspended operation when theread operation of the semiconductor memory in the suspend state iscompleted. When the selected semiconductor memory is in the ready state,the command generator 122C may skip an operation of generating thesuspend command Suspend_CMD, and generate and output the read commandRead_CMD, in response to the suspend enable signal suspend_en generatedby the suspend determiner 1222B. The suspend command Suspend_CMD, theread command Read_CMD, and the resume command Resume_CMD may betransmitted to the selected semiconductor memory through the flashcontroller 1250 shown in FIG. 2.

FIG. 4 is a diagram illustrating the semiconductor memory 100 shown inFIG. 1.

Referring to FIG. 4, the semiconductor memory 100 may include a memorycell array 10 which stores data. The semiconductor memory 100 mayinclude peripheral circuits 200 configured to perform a programoperation for storing data in the memory cell array 10, a read operationfor outputting the stored data, and an erase operation for erasing thestored data. The semiconductor memory 100 may include a control logic300 which controls the peripheral circuits 200 under the control of thecontroller (1200 shown in FIG. 1).

The memory cell array 10 may include a plurality of memory blocks MB1 toMBk 11 (k is a positive integer). Local lines LL and bit lines BL1 toBLm (m is a positive integer) may be coupled to the memory blocks MB1 toMBk 11. For example, the local lines LL may include a first select line,a second select line, and a plurality of word lines arranged between thefirst and second select lines. Also, the local lines LL may includedummy lines arranged between the first select line and the word lines,and between the second select line and the word lines. The first selectline may be a source select line, and the second select line may be adrain select line. For example, the local lines LL may include wordlines, drain and source select lines, and source lines SL. For example,the local lines LL may further include dummy lines. For example, thelocal lines LL may further include pipe lines. The local lines LL may becoupled to the memory blocks MB1 to MBk 11, respectively, and the bitlines BL1 to BLm may be commonly coupled to the memory blocks MB1 to MBk11. The memory blocks MB1 to MBk 11 may be implemented in atwo-dimensional or three-dimensional structure. For example, memorycells may be arranged in a direction parallel to a substrate in memoryblocks 11 having a two-dimensional structure. For example, memory cellsmay be arranged in a direction vertical to a substrate in memory blocks11 having a three-dimensional structure.

The peripheral circuits 200 may be configured to perform program, read,and erase operations of a selected memory block 11 under the control ofthe control logic 300. For example, the peripheral circuits 200 mayinclude a voltage generating circuit 210, a row decoder 220, a pagebuffer group 230, a column decoder 240, an input/output circuit 250, apass/fail check circuit 260, and a source line driver 270.

The voltage generating circuit 210 may generate various operatingvoltages Vop used for program, read, and erase operations in response toan operation signal OP_CMD. Also, the voltage generating circuit 210 mayselectively discharge the local lines LL in response to the operationsignal OP_CMD. For example, the voltage generating circuit 210 maygenerate a program voltage, a verify voltage, a pass voltage, and aselect transistor operation voltage under the control of the controllogic 300.

The row decoder 220 may transfer the operating voltages Vop to locallines LL coupled to the selected memory block 11 in response to rowdecoder control signals AD_signals. For example, the row decoder 220 mayselectively apply operation voltages (e.g., a program voltage, a verifyvoltage, a pass voltage, and the like) generated by the voltagegenerating circuit 210 to word lines among the local lines LL inresponse to the row decoder control signals AD_signals.

In a program voltage applying operation, the row decoder 220 applies aprogram voltage generated by the voltage generating circuit 210 to aselected word line among the local lines LL in response to the rowdecoder control signals AD_signals, and applies a pass voltage generatedby the voltage generating circuit 210 to the other unselected wordlines. Also, in a read operation, the row decoder 220 applies a readvoltage generated by the voltage generating circuit 210 to a selectedword line among the local lines LL in response to the row decodercontrol signals AD_signals, and applies a pass voltage generated by thevoltage generating circuit 210 to the other unselected word lines.

The page buffer group 230 may include a plurality of page buffers PB1 toPBm 231 coupled to the bit lines BL1 to BLm. The page buffers PB1 to PBm231 may operate in response to page buffer control signals PBSIGNALS.For example, the page buffers PB1 to PBm 231 may temporarily store datato be programmed in a program operation, or sense voltages or currentsof the bit lines BL1 to BLm in a read or verify operation.

The column decoder 240 may transfer data between the input/outputcircuit 250 and the page buffer group 230 in response to a columnaddress CADD. For example, the column decoder 240 may exchange data withthe page buffers 231 through data lines DL, or exchange data with theinput/output circuit 250 through column lines CL.

The input/output circuit 250 may transfer an internal command CMD and anaddress ADD, which are received from the controller (1200 shown in FIG.1), to the control logic 300, or exchange data DATA with the columndecoder 240. The input/output circuit 250 may output, to the controller1200, status read data SR_DATA received from a status register 320 in astatus read operation.

In a read operation or verify operation, the pass/fail check circuit 260may generate a reference current in response to an allow bit VRY_BIT<#>,and output a pass signal PASS or a fail signal FAIL by comparing asensing voltage VPB received from the page buffer group 230 with areference voltage generated by the reference current.

The source line driver 270 may be coupled to a memory cell included inthe memory cell array 10 through a source line SL, and control a voltageapplied to the source line SL. The source line driver 270 may receive asource line control signal CTRL_SL from the control logic 300, andcontrol a source line voltage applied to the source line SL, based onthe source line control signal CTRL_SL.

The control logic 300 may control the peripheral circuits 200 byoutputting the operation signal OP_CMD, the row decoder control signalsAD_signals, the page buffer control signals PBSIGNALS, and the allow bitVRY_BIT<#>in response to the internal command CMD and the address ADD.Also, the control logic 300 may determine whether the verify operationhas passed or failed in response to the pass or fail signal PASS orFAIL. When a suspend command is received from the controller 1200, thecontrol logic 300 may suspend the currently ongoing memory operation.When a read command is received from the controller 1200, the controllogic 300 may perform a read operation corresponding to the read commandand transmit read data to the controller 1200. When a resume command isreceived from the controller 1200, the control logic 300 may resume theoperation suspended by the suspend command.

The control logic 300 may include a ready/busy signal generator 310 andthe status register 320.

The ready/busy signal generator 310 generates and outputs a ready/busysignal R/B representing whether the semiconductor memory 100 is in aready state in which the semiconductor memory 100 is ready for anoperation without performing a memory operation such as a programoperation, a read operation, an erase operation, or the like of thesemiconductor memory 100 or in a busy state in which the semiconductormemory 100 is performing the memory operation.

The status register 320 stores detailed information of a currentlyongoing memory operation. For example, the status register 320 may storedetailed information of a memory operation, which includes the currentlyongoing memory operation and information on a detailed period of theoperation being currently performed. When a status read command isreceived from the controller (1200 shown in FIG. 1), the status register320 may output the stored detailed information of the memory operationas status read data SR_DATA.

FIG. 5 is a diagram illustrating the memory block shown in FIG. 4.

Referring to FIG. 5, in the memory block 11, a plurality of word linesarranged in parallel to one another may be coupled between a firstselect line and a second select line. The first select line may be asource select line SSL, and the second select line may be a drain selectline DSL. More specifically, the memory block 11 may include a pluralityof strings ST coupled between bit lines BL1 to BLm and a source line SL.The bit lines BL1 to BLm may be coupled to the strings ST, respectively,and the source line SL may be commonly coupled to the strings ST. Thestrings ST may be configured identically to one another, and therefore,a string ST coupled to a first bit line BL1 will be described in detailas an example.

The string ST may include a source select transistor SST, a plurality ofmemory cells F1 to F16, and a drain select transistor DST, which arecoupled in series between the source line SL and the first bit line BL1.At least one source select transistor SST and at least one drain selecttransistor DST may be included in one string ST, and a number of memorycells greater than the number of the memory cells F1 to F16 shown in thedrawing may be included in the one string ST.

A source of the source select transistor SST may be coupled to thesource line SL, and a drain of the drain select transistor DST may becoupled to the first bit line BL1. The memory cells F1 to F16 may becoupled in series between the source select transistor SST and the drainselect transistor DST. Gates of source select transistors SST includedin different strings ST may be coupled to the source select line SSL,gates of drain select transistors DST included in different strings STmay be coupled to the drain select line DSL, and gates of the memorycells F1 to F16 included in different strings ST may be coupled to theplurality of word lines WL1 to WL16. A group of memory cells coupled tothe same word line among the memory cells included in different stringsST may be referred to as a physical page PPG. Therefore, a number ofphysical pages PPG which corresponds to the number of word lines WL1 toWL16 may be included in the memory block 11.

When one memory cell stores data of one bit, the memory cell isgenerally referred to as a single level cell (SLC). Therefore, onephysical page PPG may store one logical page (LPG) data. One LPG datamay include data bits corresponding to a number of cells included in onephysical page PPG. In addition, when one memory cell stores data of twoor more bits, the memory cell is generally referred to as a multi-levelcell (MLC). Therefore, one physical page PPG may store two or more LPGdata.

FIG. 6 is a diagram illustrating an embodiment of a three-dimensionallyconfigured memory block. Referring to FIG. 6, the memory cell array 10may include a plurality of memory blocks MB1 to MBk 11. The memory block11 may include a plurality of strings ST11 to ST1m and ST21 to ST2m. Inan embodiment, each of the plurality of strings ST11 to ST1m and ST21 toST2m may be formed in a ‘U’ shape. In the memory block 11, m strings maybe arranged in a row direction (X direction). Although a case where twostrings are arranged in a column direction (Y direction) is illustratedin FIG. 6, this is for convenience of description, and three or morestrings may be arranged in the column direction (Y direction).

Each of the plurality of strings ST11 to ST1m and ST21 to ST2m mayinclude at least one source select transistor SST, first to nth memorycells MC1 to MCn, a pipe transistor PT, and at least one drain selecttransistor DST.

The source and drain select transistors SST and DST, and the memorycells MC1 to MCn may have structures similar to one another. Forexample, each of the source and drain select transistors SST and DST andthe memory cells MC1 to MCn may include a channel layer, a tunnelinsulating layer, a charge trapping layer, and a blocking insulatinglayer. For example, a pillar for providing the channel layer may beprovided in each string. For example, a pillar for providing at leastone of the channel layer, the tunnel insulating layer, the chargetrapping layer, and the blocking insulating layer may be provided ineach string.

The source select transistor SST of each string may be coupled between asource line SL and memory cells MC1 to MCp.

In an embodiment, source select transistors of strings arranged on thesame row may be coupled to a source select line extending in the rowdirection, and source select transistors of strings arranged indifferent rows may be coupled to different source select lines. In FIG.6, source select transistors of strings ST11 to ST1m of a first row maybe coupled to a first source select line SSL1. Source select transistorsof strings ST21 to ST2m of a second row may be coupled to a secondsource select line SSL2.

In another embodiment, the source select transistors of the strings ST11to ST1m and ST21 to ST2m may be commonly coupled to one source selectline.

The first to nth memory cells MC1 to MCn of each string may be coupledbetween the source select transistor SST and the drain select transistorDST.

The first to nth memory cells MC1 to MCn may be divided into first topth memory cells MC1 to MCp and (p+1)th to nth memory cells MCp+1 toMCn. The first to pth memory cells MC1 to MCp may be sequentiallyarranged in a vertical direction (Z direction), and be coupled in seriesto each other between the source select transistor SST and the pipetransistor PT. The (p+1)th to nth memory cells MCp+1 to MCn may besequentially arranged in the vertical direction (Z direction), and becoupled in series to each other between the pipe transistor PT and thedrain select transistor DST. The first to pth memory cells MC1 to MCpand the (p+1)th to nth memory cells MCp+1 to MCn may be coupled to eachother through the pipe transistor PT. Gates of the first to nth memorycells MC1 to MCn of each string may be coupled to first to nth wordlines WL1 to WLn, respectively.

In an embodiment, at least one of the first to nth memory cells MC1 toMCn may be used as a dummy memory cell. When the dummy memory cell isprovided, a voltage or current of a corresponding string can be stablycontrolled. A gate of the pipe transistor PT of each string may becoupled to the pipe line PL.

The drain select transistor DST of each string may be coupled to a bitline and the memory cells MCp+1 to MCn. Strings arranged in the rowdirection may be coupled to a drain select line extending in the rowdirection. Drain select transistors of the strings ST11 to ST1m on thefirst row may be coupled to a first drain select line DSL1. Drain selecttransistors of the strings ST21 to ST2m on the second row may be coupledto a second drain select line DSL2.

Strings arranged in the column direction may be coupled to bit linesextending in the column direction. In FIG. 6, strings ST11 and ST21 of afirst column may be coupled to a first bit line BL1. Strings ST1m andST2m of an mth column may be coupled to an mth bit line BLm.

Memory cells coupled to the same word line among the strings arranged inthe row direction may constitute one page. For example, memory cellscoupled to the first word line WL1 among the strings ST11 to ST1m of thefirst row may constitute one page. Memory cells coupled to the firstword line WL1 among the strings ST21 to ST2m of the second row mayconstitute another page. When any one of the drain select lines DSL1 andDSL2 is selected, strings arranged in one row direction may be selected.When any one of the word lines WL1 to WLn is selected, one page amongthe selected strings may be selected.

FIG. 7 is a diagram illustrating another embodiment of thethree-dimensionally configured memory block.

Referring to FIG. 7, the memory cell array 10 may include a plurality ofmemory blocks MB1 to MBk 11. The memory block 11 may include a pluralityof strings ST11′ to ST1m′ and ST21′ to ST2m′. Each of the plurality ofstrings ST11′ to ST1m′ and ST21′ to ST2m′ may extend along a verticaldirection (Z direction). In the memory block 11, m strings may bearranged in a row direction (X direction). Although a case where twostrings are arranged in a column direction (Y direction) is illustratedin FIG. 7, this is for convenience of description, and three or morestrings may be arranged in the column direction (Y direction).

Each of the plurality of strings ST11′ to ST1m′ and ST21′ to ST2m′ mayinclude at least one source select transistor SST, first to nth memorycells MC1 to MCn, and at least one drain select transistor DST.

The source select transistor SST of each string may be coupled between asource line SL and the memory cells MC1 to MCn. Source selecttransistors of strings arranged in the same row may be coupled to thesame source select line. Source select transistors of strings ST11′ toST1m′ arranged on a first row may be coupled to a first source selectline SSL1. Source select transistors of strings ST21′ to ST2m′ arrangedon a second row may be coupled to a second source select line SSL2. Inanother embodiment, the source select transistors of the strings ST11′to ST1m′ and ST21′ to ST2m′ may be commonly coupled to one source selectline.

The first to nth memory cells MC1 to MCn of each string may be coupledin series between the source select transistor SST and the drain selecttransistor DST. Gates of the first to nth memory cells MC1 to MCn may becoupled to first to nth word lines WL1 to WLn, respectively.

In an embodiment, at least one of the first to nth memory cells MC1 toMCn may be used as a dummy memory cell. When the dummy memory cell isprovided, a voltage or current of a corresponding string can be stablycontrolled. Accordingly, the reliability of data stored in the memoryblock 11 can be improved.

The drain select transistor DST of each string may be coupled between abit line and the memory cells MC1 to MCn. Drain select transistors DSTof strings arranged in the row direction may be coupled to a drainselect line extending in the row direction. The drain select transistorsDST of the strings ST11′ to ST1m′ of the first row may be coupled to afirst drain select line DSL1. The drain select transistors DST of thestrings ST21′ to ST2m′ of the second row may be coupled to a seconddrain select line DSL2.

FIG. 8 is a flowchart illustrating an operating method of the memorysystem in accordance with an embodiment of the present disclosure.

The operating method of the memory system in accordance with theembodiment of the present disclosure will be described as follows withreference to FIGS. 1 to 8.

When a host command Host_CMD for a specific operation subject to asuspend operation is received from the host 1400 (S810), the suspendcontroller 1222 checks whether a selected semiconductor memory 100 amonga plurality of semiconductor memories 100 included in the memory device1100 is allowed to perform the suspend operation (S820).

In the step S820 of checking whether the selected semiconductor memory100 is allowed to perform the suspend operation, the controller 1200receives a ready/busy signal R/B and status read data SR_DATA from theselected semiconductor memory 100, and checks whether the selectedsemiconductor memory 100 is allowed to perform the suspend operationbased on the ready/busy signal R/B and the status read data SR_DATA. Forexample, the controller 1200 determines that the selected semiconductormemory 100 is allowed to perform the suspend operation when the selectedsemiconductor memory 100 is in a ready state or when the selectedsemiconductor memory 100 performs an operation corresponding to asuspension-allowed period while being in a busy state. Also, thecontroller 1200 determines that the selected semiconductor memory 100 isnot allowed to perform the suspend operation when the selectedsemiconductor memory 100 performs an operation corresponding to asuspension-prohibited period.

When it is determined in the step S820 of checking whether the selectedsemiconductor memory 100 is allowed to perform the suspend operationthat the selected semiconductor memory 100 is not allowed to perform thesuspend operation as a result obtained by determining whether theselected semiconductor memory 100 is allowed to perform the suspendoperation (S830) (No), the suspend determiner 1222B generates andoutputs a suspend disable signal suspend_dis, and the status checker1222A generates and outputs a status read command SR_CMD for controllingthe selected semiconductor memory to perform a status read operation.The selected semiconductor memory outputs new status read data SR_DATAin response to the status read command SR_CMD, and the suspenddeterminer 1222B repeats the above-described processes from the stepS820 by using the new status read data SR_DATA.

When it is determined that the selected semiconductor memory 100 isallowed to perform the suspend operation, as a result obtained bydetermining whether the selected semiconductor memory 100 is allowed toperform the suspend operation (S830) (Yes), the suspend determiner 1222Bgenerates and outputs a suspend enable signal suspend_en. The commandgenerator 1222C generates and outputs a suspend command Suspend_CMD forsuspending a currently ongoing memory operation of the selectedsemiconductor memory, in response to the suspend enable signalsuspend_en generated by the suspend determiner 1222B. The suspendcommand Suspend_CMD may be transmitted to the selected semiconductormemory through the flash controller 1250 shown in FIG. 2 (S840). Theselected semiconductor memory suspends the currently ongoing memoryoperation, in response to the suspend command Suspend_CMD.

Subsequently, the selected semiconductor memory may receive a commandfor the specific operation from the controller 1200 and perform thespecific operation in response to the command. When the specificoperation is completed, the selected semiconductor memory may receive aresume command from the controller 1200 and resume the operation thatwas being performed before the operation was suspended by the suspendcommand Suspend_CMD (S850).

FIG. 9 is a flowchart illustrating an operating method of the memorysystem in accordance with another embodiment of the present disclosure.

The operating method of the memory system in accordance with theembodiment of the present disclosure will be described as follows withreference to FIGS. 1 to 7 and 9.

When a host command Host_CMD corresponding to a read operation isreceived from the host 1400 (S910), the suspend controller 1220 maygenerate and output a status read command SR_CMD for controlling aselected semiconductor memory 100 among a plurality of semiconductormemories 100 included in the memory device 1100 to perform a status readoperation of the selected semiconductor memory 100. The status readcommand SR_CMD generated by the suspend controller 1222 may betransmitted to the selected semiconductor memory through the flashcontroller 1250.

The suspend controller 1222 determines a current state of the selectedsemiconductor memory, based on status read data SR_DATA and a ready/busysignal R/B, which are received from the selected semiconductor memory,and performs a status check operation of determining whether theselected semiconductor memory is allowed to perform a suspend operation,based on the determination result (S920).

First, the suspend determiner 1222B determines whether the selectedsemiconductor memory is in a ready state, based on the ready/busy signalR/B received from the selected semiconductor memory (S930).

As a result of the step S930 of determining whether the selectedsemiconductor memory is in the ready state, when the selectedsemiconductor memory is in the ready state (Yes), the command generator1222C generates and outputs a read command Read_CMD for controlling theselected semiconductor memory to perform a read operation, in responseto a suspend enable signal suspend_en generated by the suspenddeterminer 1222B, and the flash controller 1250 transmits the readcommand Read_CMD generated by the command generator 1222C to theselected semiconductor memory (S940).

The selected semiconductor memory reads data DATA stored in acorresponding area in response to the received read command Read_CMD,and performs the read operation of transmitting the read data DATA tothe controller 1200 (S950). The data DATA transmitted to the controller1200 may be temporarily stored in the memory buffer 1230 and then betransmitted to the host 1400 through the host controller 1210.

As a result of the step S930 of determining whether the selectedsemiconductor memory is in the ready state, when the selectedsemiconductor memory is in a busy state (No), the suspend determiner1222B determines whether the selected semiconductor memory is currentlyperforming a read operation, based on the status read data SR_DATAreceived from the selected semiconductor memory (S960). The readoperation of step S960 may not be the specific operation subject to thesuspend operation rather a memory operation, such as a program operationand an erase operation, may be subject to the suspend operation.Therefore, during the read operation of step S960, the suspend operationmay not be allowed.

As a result of the step S960 of determining whether the selectedsemiconductor memory is currently performing the read operation, when itis determined that the selected semiconductor memory is currentlyperforming the read operation (Yes), the memory system waits for acertain time (S970), and repeats the above-described processes from thestep S930.

As a result of the step S960 of determining whether the selectedsemiconductor memory is currently performing the read operation, when itis determined that the selected semiconductor memory is currentlyperforming a memory operation (e.g., a program operation or an eraseoperation) other than the read operation (No), the suspend determiner12228 checks whether the selected semiconductor memory is allowed toperform a suspend operation based on the status read data SR_DATA(S980).

The suspend determiner 12228 determines that the selected semiconductormemory is allowed to perform the suspend operation when it is determinedthat the selected semiconductor memory is currently performing a programoperation or erase operation (other than a read operation) and isperforming an operation corresponding to a suspension-allowed periodduring the program operation or erase operation, based on the statusread data SR_DATA. The suspend determiner 12228 determines that theselected semiconductor memory is not allowed to perform the suspendoperation when it is determined that the selected semiconductor memoryis currently performing a program operation or erase operation (otherthan a read operation) and is performing an operation corresponding tothe suspension-prohibited period during the program operation or eraseoperation, based on the status read data SR_DATA.

As a result obtained by determining, by the suspend determiner 12228,(S990), when the selected semiconductor memory 100 is not allowed toperform the suspend operation (No), the suspend determiner 12228generates and outputs a suspend disable signal suspend_dis, and thestatus checker 1222A generates and outputs a status read command SR_CMDfor controlling the selected semiconductor memory to perform a statusread operation in response to the suspend disable signal suspend_dis.The selected semiconductor memory outputs new status read data SR_DATAto the suspend determiner 12228 in response to the status read commandSR_CMD, and the suspend determiner 12228 repeats the above-describedprocesses from the step S980 by using the new status read data SR_DATA.

As a result obtained by determining, by the suspend determiner 12228,(S990), when the selected semiconductor memory 100 is allowed to performthe suspend operation (Yes), the suspend determiner 12228 generates andoutputs a suspend enable signal suspend_en. The command generator 1222Cgenerates and outputs a suspend command Suspend_CMD for suspending acurrently ongoing memory operation of the selected semiconductor memory,in response to the suspend enable signal suspend_en generated by thesuspend determiner 12228. The suspend command Suspend_CMD may betransmitted to the selected semiconductor memory through the flashcontroller 1250 shown in FIG. 2 (S1000). The selected semiconductormemory suspends the operation being currently performed in response tothe suspend command Suspend_CMD. The command generator 1222C generatesand outputs a read command Read_CMD such that the selected semiconductormemory performs a read operation in response to the suspend enablesignal suspend_en generated by the suspend determiner 1222B, and theflash controller 1250 transmits the read command Read_CMD generated bythe command generator 1222C to the selected semiconductor memory(S1010).

The selected semiconductor memory performs a read operation of readingdata DATA stored in a corresponding area in response to the receivedread command Read_CMD and transmitting the read data DATA to thecontroller 1200 (S1020). The data DATA transmitted to the controller1200 may be temporarily stored in the memory buffer 1230 and then betransmitted to the host 1400 through the host controller 1210.

When the read operation is completed, the command generator 1222Cgenerates and outputs a resume command Resume_CMD, and the flashcontroller 1250 transmits the resume command Resume CMD to the selectedsemiconductor memory (S1030).

The selected semiconductor memory resumes the suspended operation inresponse to the resume command Resume_CMD (S1040).

FIG. 10A to 10C are diagrams illustrating status read commands in asuspend operation in accordance with an embodiment of the presentdisclosure.

Referring to FIG. 10A, like a general status read command, a status readcommand generated by the status checker 1222A shown in FIG. 3 mayinclude a signal 70h notifying reception of a command through a dataline DQ of a semiconductor memory and a signal SR[X] representing thestatus read command. The status read command may be used in addition tothe suspend operation.

Referring to FIG. 10B, a status read command generated by the statuschecker 1222A may include a signal Suspend representing the suspendoperation, in addition to a signal 70h notifying reception of a commandand a signal SR[X] representing the status read command as shown in FIG.10A.

Referring to FIG. 10C, a status read command generated by the statuschecker 1222A may include a signal XXh notifying reception of a specificcommand and a signal Suspend representing the suspend operation.

FIGS. 11A and 11B are diagrams illustrating configurations of an eraseoperation and a program operation.

Referring to FIG. 11A, in an erase operation of a semiconductor memory,an erase loop may be repeatedly performed at least once. The erase loopmay include a GIDL generation period t1, an erase voltage applicationperiod t2, a discharge period t3, an erase verify period t4, and thelike. In an embodiment of the present disclosure, the GIDL generationperiod t1 may be set as a suspension-prohibited period, and the erasevoltage application period t2, the discharge period t3, the erase verifyperiod t4, and the like may be set as a suspension-allowed period.

Referring to FIG. 11B, in a program operation of a semiconductor memory,a program loop may be repeatedly performed at least once. The programloop may include a bit line setting period t1, a program voltageapplication period t2, a discharge period t3, a program verify periodt4, and the like. In an embodiment of the present disclosure, theprogram voltage application period t2 may be set as asuspension-prohibited period, and the bit line setting period t1, thedischarge period t3, the program verify period t4, and the like may beset as a suspension-allowed period.

The suspension-prohibited period and the suspension-allowed period inthe erase operation and the program operation may be changed and set.

In accordance with the above-described embodiment of the presentdisclosure, a suspend operation of a semiconductor memory is performedwhen a host command corresponding to a read operation is received fromthe host. The suspend operation can be performed by avoiding a weakperiod in which the reliability of the semiconductor memory isdeteriorated, such as the GIDL generation period of the erase operationor the program voltage application period of the program operation.

FIG. 12 is a diagram illustrating another embodiment of the memorysystem.

Referring to FIG. 12, the memory system 30000 may be implemented as acellular phone, a smart phone, a tablet PC, a personal digital assistant(PDA), or a wireless communication device. The memory system 30000 mayinclude a memory device 1100 and a controller 1200 capable ofcontrolling an operation of the memory device 1100. The controller 1200may control a data access operation of the memory device 1100, e.g., aprogram operation, an erase operation, a read operation, or the likeunder the control of a processor 3100.

Data programmed in the memory device 1100 may be output through adisplay 3200 under the control of the controller 1200.

A radio transceiver 3300 may transmit/receive radio signals through anantenna ANT. For example, the radio transceiver 3300 may change a radiosignal received through the antenna ANT into a signal that can beprocessed by the processor 3100. Therefore, the processor 3100 mayprocess a signal output from the radio transceiver 3300 and transmit theprocessed signal to the controller 1200 or the display 3200. Thecontroller 1200 may transmit the signal processed by the processor 3100to the memory device 1100. Also, the radio transceiver 3300 may change asignal output from the processor 3100 into a radio signal, and outputthe changed radio signal to an external device through the antenna ANT.An input device 3400 is a device capable of inputting a control signalfor controlling an operation of the processor 3100 or data to beprocessed by the processor 3100, and may be implemented as a pointingdevice such as a touch pad, a computer mouse, a keypad, or a keyboard.The processor 3100 may control an operation of the display 3200 suchthat data output from the controller 1200, data output from the radiotransceiver 3300, or data output from the input device 3400 can beoutput through the display 3200.

In some embodiments, the controller 1200 capable of controlling anoperation of the memory device 1100 may be implemented as a part of theprocessor 3100, or be implemented as a chip separate from the processor3100. Also, the controller 1200 may be implemented with the controllershown in FIG. 2.

FIG. 13 is a diagram illustrating another embodiment of the memorysystem.

Referring to FIG. 13, the memory system 40000 may be implemented as apersonal computer (PC), a tablet PC, a net-book, an e-reader, a personaldigital assistant (PDA), a portable multi-media player (PMP), an MP3player, or an MP4 player.

The memory system 40000 may include a memory device 1100 and acontroller 1200 capable of controlling a data processing operation ofthe memory device 1100.

A processor 4100 may output data stored in the memory device 1100through a display 4300 according to data input through an input device4200. For example, the input device 4200 may be implemented as apointing device such as a touch pad, a computer mouse, a keypad, or akeyboard.

The processor 4100 may control overall operations of the memory system40000, and control an operation of the controller 1200. In someembodiments, the controller 1200 capable of controlling an operation ofthe memory device 1100 may be implemented as a part of the processor4100, or be implemented as a chip separate from the processor 4100.Also, the controller 1200 may be implemented with the controller shownin FIG. 2.

FIG. 14 is a diagram illustrating another embodiment of the memorysystem.

Referring to FIG. 14, the memory system 50000 may be implemented as animage processing device, e.g., a digital camera, a mobile terminalhaving a digital camera attached thereto, a smart phone having a digitalcamera attached thereto, or a tablet PC having a digital camera attachedthereto.

The memory system 50000 may include a memory device 1100 and acontroller 1200 capable of controlling a data processing operation ofthe memory device 1100, e.g., a program operation, an erase operation,or a read operation.

An image sensor 5200 of the memory system 50000 may convert an opticalimage into digital signals, and the converted digital signals may betransmitted to a processor 5100 or the controller 1200. Under thecontrol of the processor 5100, the converted digital signals may beoutput through a display 5300, or be stored in the memory device 1100through the controller 1200. In addition, data stored in the memorydevice 1100 may be output through the display 5300 under the control ofthe processor 5100 or the controller 1200.

In some embodiments, the controller 1200 capable of controlling anoperation of the memory device 1100 may be implemented as a part of theprocessor 5100, or be implemented as a chip separate from the processor5100. Also, the controller 1200 may be implemented with the controllershown in FIG. 2.

FIG. 15 is a diagram illustrating another embodiment of the memorysystem. Referring to FIG. 15, the memory system 70000 may be implementedas a memory card or a smart card. The memory system 70000 may include amemory device 1100, a controller 1200, and a card interface 7100.

The controller 1200 may control data exchange between the memory device1100 and the card interface 7100. In some embodiments, the cardinterface 7100 may be a secure digital (SD) card interface or amulti-media card (MMC) interface, but the present disclosure is notlimited thereto. Also, the controller 1200 may be implemented with thecontroller shown in FIG. 2.

The card interface 7100 may interface data exchange between a host 60000and the controller 1200 according to a protocol of the host 60000. Insome embodiments, the card interface 7100 may support a universal serialbus (USB) protocol and an inter-chip (IC)-USB protocol. The cardinterface 7100 may mean hardware capable of supporting a protocol usedby the host 60000, software embedded in the hardware, or a signaltransmission scheme.

When the memory system 70000 is coupled to a host interface 6200 of thehost 60000 such as a PC, a tablet PC, a digital camera, a digital audioplayer, a cellular phone, console video game hardware, or a digitalset-top box, the host interface 6200 may perform data communication withthe memory device 1100 through the card interface 7100 and thecontroller 1200 under the control of a microprocessor 6100.

In accordance with the present disclosure, a suspend operation in anoperation period having large reliability degradation is suppressedbased on status data of the semiconductor memory, so that thereliability of the memory system can be improved.

While the present disclosure has been shown and described with referenceto certain exemplary embodiments thereof, it will be understood by thoseskilled in the art that various changes in form and details may be madetherein without departing from the spirit and scope of the presentdisclosure as defined by the appended claims and their equivalents.Therefore, the scope of the present disclosure should not be limited tothe above-described exemplary embodiments but should be determined bynot only the appended claims but also the equivalents thereof.

In the above-described embodiments, all steps may be selectivelyperformed, or parts of the steps may be omitted. In each embodiment, thesteps are not necessarily performed in accordance with the describedorder and may be rearranged. The embodiments disclosed in thisspecification and drawings are only examples to facilitate anunderstanding of the present disclosure, and the present disclosure isnot limited thereto. That is, it should be apparent to those skilled inthe art that various modifications can be made on the basis of thetechnological scope of the present disclosure.

Meanwhile, the exemplary embodiments of the present disclosure have beendescribed in the drawings and specification. Although specificterminologies are used here, those are only to describe the embodimentsof the present disclosure. Therefore, the present disclosure is notrestricted to the above-described embodiments and many variations arepossible within the spirit and scope of the present disclosure. Itshould be apparent to those skilled in the art that variousmodifications can be made on the basis of the technological scope of thepresent disclosure in addition to the embodiments disclosed herein.

What is claimed is:
 1. An operating method for a controller forcontrolling a memory device, the operating method comprising controllingthe memory device to: perform a second memory operation while suspendinga first memory operation which is currently being performed, during asuspension-allowed period of the first memory operation; and resume thesuspended first memory operation upon completion of the second memoryoperation.
 2. An operating method of a memory device, the operatingmethod comprising: performing a second memory operation while suspendinga first memory operation, which is currently being performed, during asuspension-allowed period of the first memory operation; and resumingthe suspended first memory operation upon completion of the secondmemory operation.